Grinding device "Hot grinding device"
Polishing is possible in a heated state. Guarantees the profile at the usage temperature.
Grinding Device "Hot Grinding Device" allows for grinding in a heated state. It guarantees the profile at the operating temperature. Non-circular grinding is possible with NC control. It is equipped with an automatic measuring device (supports up to φ1,000). 【Machine Specifications】 ○ Processing Size: φ1,400mm × 8,000mm (total length) ○ Maximum Weight: 35,000kg ○ Processing Temperature: MAX 250℃ (when using heat) → When using hot water, up to 200℃ For more details, please contact us or download the catalog.
- Company：野村鍍金
- Price：Other
